Semiconductor Packaging Technology
Wafer-level packaging technology Through-silicon-via (TSV)
packaging technology CMOS image sensor (CIS) packaging
technology, Bio-identification IC packaging technology MEMS
packaging technology
Intelligent Automatic Detection Technology
One-stop service for Intelligent Automatic Detection
Wireless Charging Technology
Electromagnetic Induction Technology Magnetic Resonance
Technology Electromagnetic Induction & Near Field
Communication Antennas
Vehicle-mounted Electronic Technology
Vehicle-mounted shark-fin multifunctional integrated antenna,
PEPS button start antenna, RF signal amplifier, DAB/CMMB
digital broadcasting antenna, vehicle-mounted radar antenna,V2X antenna syste
Intelligent Terminal Antenna Technology
Radio Frequency Technology, Process Technology, Material Technology
Bio-identification Technology
TVS Ultra-thin solution, Water-proof, Underglass
Screen-printing Coating, Full Automatic Cover/ Coating Line
Global layout
The company is headquartered in Huizhou City,Guangdong Province,which hasbranch offices and R&D centers in Shenzhen, Suzhou, Beijing, Xi'an, Shanghai, Taipei, South Korea, the United States and other regions, and set up Huizhou SPEED Institute of Technology Innovation and the first Nobel Prize workstation in Guangdong Province. The company has a R&D team with nearly 800 technical staff, which is equipped with the leading level of equipment in the world and integrates research and development, sales and services as one.
- 北京
惠州碩貝德無線科技股份有限公司北京分公司
地址：北京市亦莊經濟開發區經海二路27院國投尚科大廈1樓
- 韓國
碩貝德韓國首爾子公司
地址：2F,33,1499,Dukyoungdaero Yeongtong-gu suwon-si Gyeonggi-do Korea
- 深圳
惠州碩貝德無線科技股份有限公司深圳分公司
地址：深圳市南山區科技園科苑路11號金融科技大廈
- 惠州
惠州碩貝德無線科技股份有限公司
地址：廣東省惠州市東江高新區上霞片區SX-01-02號
- 上海
惠州碩貝德無線科技股份有限公司上海分公司
地址：上海市閔興區吳中路1439萊茵虹景B棟
- 臺灣
碩貝德臺灣分公司
地址：338-61桃園縣蘆竹鄉六福路46之6號
- 亞特蘭大
研究所
地址：85年第五街85號西北亞特蘭大,喬治亞州,美國
Service Hotline：0752-2836239
© 2017 Huizhou SPEED Wireless Technology Co., Ltd. . All Rights Reserved.Designed ICP證0301